PN |
DESCRIPTION |
ADHESION (1) |
ADHESION (2) |
1020R |
Ultraviolet Film (PVC), 95 microns thick (3.8 mils), supplied in 100 meter (330') rolls with backing (typical use - wafer backgrinding or dicing) (Note: very high Adhesive Strength to begin with, desirable for dicing operations, then reduces to a very low Adhesive Strength level after exposure to UV light, ideal for pick and place operations) |
@30 mins (Si) 375/20* @24 hours (Si) 308/14* |
@30 mins (Si) 320/15* @24 hours (Si) 247/12* |
1027R |
Super-High Tack Anti-static Ultraviolet Film (Poly Olefin) of 175 microns thick in 100 meter (330') rolls with PET backing (typical use is for backgrinding or dicing) |
@30 mins (Si) 1850/28* @24 hours (Si) 1980/33* |
@30 mins (Si)2080/28* @24 hours (Si)2160/33* |
1042R |
Anti-static Ultraviolet Film (Poly Olefin) of 98 microns thick in 100 meter (330') rolls with Polyester backing (typical use is for thin wafer dicing) |
@30 mins (Si) 300/25* @24 hours (Si) 550/28* |
@30 mins (Si) 300/10* @24 hours (Si) 600/10* |
1043R |
Anti-static Ultraviolet Film (Poly Olefin) of 168 microns thick in 100 meter (330') rolls with Polyester backing (typical use is for thin wafer dicing) |
@30 mins (Si) 890/20* @24 hours (Si) 1042/60* |
@30 mins (Si)1035/15* @24 hours (Si)1105/28* |
1044R |
Anti-static Ultraviolet Film (Poly Olefin) of 268 microns thick in 100 meter (330') rolls with Polyester backing (typical use is for thin wafer dicing) |
@30 mins (Si) 350/29* @24 hours (Si) 650/35* |
@30 mins (Si) 400/15* @24 hours (Si) 700/15* |
(2) adhesion is measured at 30 minutes and 24hours after application to Silicon Wafer, using grams per 25 mm width
*These numbers are before curing adhesive levels/after curing adhesive levels.
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